Form Factors:OSFP and QSFP-DD have emerged as the dominant form factors, with OSFP providing better thermal performance and QSFP-DD offering backward compatibility. •AI infrastructure race fueled a Capex surge in 2024 to approximately $200bn •2025 Capex Projection to near $350bn and 2030 Capex projection to near $545bn •Capex funding facilities expansion, xPU acquisition •Expectations of continued growth through 2030 with generative AI adoption both at the. Optical Module and DCI by Application (Communication Service Provider, Internet Content and Carrier Neutral Provider, Government/Research and Education, Other), by Types (Optical Transport Network, Data Center Core Network, WAN), by North America (United States, Canada, Mexico), by South America. IDTechEx's latest report, "Co-Packaged Optics 2025-2035: Technologies, Market, and Forecasts," explores these advancements in CPO technology and packaging techniques enabling its adoption. Key trend of optical transceiver in high-end data center. Linear drive pluggable optics (LPO). Modulation and Encoding:Current 800G modules predominantly use PAM4 (4-level Pulse Amplitude Modulation) signaling at 100 Gbaud per lane. With 8 lanes, this achieves 800 Gbps total bandwidth. The technology leverages advanced DSP (Digital Signal Processing) for equalization, FEC (Forward Error. Optical Module Chip Market size was valued at US$ 823 million in 2024 and is projected to reach US$ 1. 52 billion by 2032, at a CAGR of 8.